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Printed Circuit Board Assembly The assembly of printed circuit boards is a multiple step process that includes surface mount technology (SMT) and through hole technology. In through hole (THT) assembly processes, the component leads are placed onto the board and the leads are soldered via a wave soldering process. Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD).

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Quantities: Prototype and small series, 1 to 50 pieces
Dimensions of the PCBs: 14.5 x 19.5 inch
Components: SMT and THT from size 0402 SOIC, PLCC, TSOP, QFP, BGA Diverse SM-exotic and SM - connectors
Assembly methods: one-sided and double-sided SMT (mechanically using the vapour phase method) THT (soldered manually or on a selective system)
Packaging of components Rods, reels, tape strips (required components incl. excess amount on a contiguous section), bulk material (please only in exceptional cases and only with a assembly of up to a maximum of 2 PCBs)
Maximum component size: 55 mm x 55 mm x 15 mm Fine Pitch from 0.4 mm Minimum connection width 0.2 mm
Min. Chip size 0201
Solder: Lead-free in accordance with DIN 32513, ISO, EN 29454, IPC 650
Data formats: At this time: EAGLE, TARGET3001!, Altium Designer and Extended Gerber, other formats upon request
Inspection X-ray analysis, Microscope to 20X
Lead time: 1-5 working days after procuring components. Which depends on number of components need to be assembled. Lesser the lead time higher the cost.