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FACTORY PRODUCTION CAPABILITY

Laminate Type FR4 ( Normal / High Tg /Halogen Free), CEM-3, Metal Core, PTFE, PI
Laminate Brands Nelco, ISOLA, Rogers, Shengyi, ITEQ, Panasonic, Teconic,Thinflex, Dupont.
Max. Finishing Board Size 1500*572mm
Min. Board Thickness 0.2mm
Max. Board Thickness 3.2mm
Min. Drill Size 0.2mm (mechanical) , 0.1mm ( laser)
Max. Layer Count 32 Layers
Max. Copper Thickness (Inner/Outer) 5oz / 10oz
Min Tracewidth / Spacing 2.5mil / 2.5mil
BGA Pitch 8mil
Aspect Ratio 16:01
Tolerance PTH / Pressing fit hole / NPTH ± 0.0762 mm / ± 0.05mm / ± 0.05mm
Impedance Tolerance ± 8%
Surface Treatment HAL, HAL Lead Free, ENIG, Immersion silver / Tin, Hard gold, OSP, Bare Copper
Special Process Flex, Rigid Flex, Blind-Burried vias, Controlled Impedance Gold fingers, Half hole PTH, Pressfit drills, Edge Plating, Via resin fil, Peelable solder mask, Backdrilling.

PCB PROTOTYPES TO VOLUME

For us, every project is important, no matter the size of your order.
We will guide you through the PCB design to PCB 
fabrication.

PCBs FOR TOYS TO SPACECRAFTS

We have given PCBs to smallest startups and companies listed
on the stock exchange. For defense application to Toys. We have got you covered.

RIGID PCB

  Rigid PCB's are well-known for its high density, high reliability, designable, testability and maintainability.

  •      Material : FR4, CEM-3, Metal Core.
  •      Layer Count: 1 to 32 Layers
  •      Board Thickness: 0.2mm to 8mm
  •      Max Dimensions: 1500*610mm
  •      Max Cu Thickness: Inner 5oz/ outer 10oz .
  •      Min Line Width/ Space: 2.5mil/ 2.5mil
  •      Aspect Ratio: 16:1
  •      Surface Finish : HASL, HASL-LF, ENIG, Immersion Silver/Tin, Peelable Mask, Carbon Paste.

FLEXIBLE PCB

They are manufactured with flexible plastic material which enables the ability to fold over edges and wrap around corners, making them become one of the most important components in today’s most advanced electronic products.

  • Layer Count: 1L to 12L
  • Board Thickness: 0.002″ – 0.1
  • Max Dimensions: 500*650mm
  • Material: PI, PET, PEN, FR-4,dupont
  • Final Cu Thickness: 1/3-2oz 
  • Impedance Control Tolerance: +/- 7%

RIGID-FLEX PCB

Rigid-Flex PCB is the combination of rigid and flexible board technologies. This allows an application to have a more streamlined design and ability to reduce the overall board size and package weight.

  • Layer Count: 2 to 18 Layers
  • Board Thickness: 0.06mm-4.0mm
  • Dimensions: 1092*660mm 
  • Final Cu Thickness: Inner 12oz/ outer 12oz 
  • Line Width/ Space: 3mil/ 3mil
  • Impedance Control Tolerance: +/- 7%

HDI PCB

HDI technology enables a PCB to have higher wiring density, which greatly enhances its electrical performance and optimizes overall package weight and dimension of an equipment.

  • Material:FR4, CEM-3, Metal Core.
  • Layer Count: 1 to 32 Layers
  • Board Thickness: 0.2mm to 8mm
  • Max Dimensions: 1500*610mm 
  • Max Cu Thickness: Inner 5oz/ outer 10oz .
  • Min Line Width/ Space: 2.5mil/ 2.5mil 
  • Aspect Ratio: 16:1
  • Surface Finish : HASL, HASL-LF, ENIG, Immersion Silver/Tin, Peelable Mask, Carbon Paste

MATERIALS